Model	HY510
Color	Grey
Thermal Conductivity	>1.93 W/m-K
Thermal Impedance	<0.225 °C-in²/W
Specific Gravity	>2 g/cm³
Viscosity	1000
Thixotropic Index	380±10 1/10mm
Moment Bore Temperature	-50°C~300°C
Operation Temperature	-30°C~280°C
Ingredients	Silicone Compounds = 50% Carbon Compounds = 30% Metal Oxide Compounds = 20%
Certification

Feature:

• Clean the CPU and heat sink surfaces, Wipe the surface lightly with a cotton ball or cotton swab dampened with alcohol or our thermal cleanser. 
• Place a tiny drop of thermal grease to the center of the cooler base, smear it evenly with scraper or finger cot, best thickness is 0.13~0.15mm.
• Attach the heat sink to the processor and Avoid removing the heat sink after installing it.